Junchao Wei

Ph.D.

Book Chapter

  • Wei, J., “Artificial Intelligence and LED degradation” in Reliability of organic compounds in microelectronics and optoelectronics. Springer, Feb.2022. [LINK] [PDF]

Journal Publications

  • Wei, J., Hua, Y., Yang, B., Wang, B., Schmitt, S. E., Wang, B., … & Sigal, I. A. (2022). Comparing Acute IOP-Induced Lamina Cribrosa Deformations Premortem and Postmortem. Translational Vision Science & Technology, 11(12), 1-1.[LINK]

  • Sibony, P. A., Wei, J., & Sigal, I. A. (2018). Gaze-Evoked Deformations in Optic Nerve Head Drusen: Repetitive Shearing as a Potential Factor in the Visual and Vascular Complications. Ophthalmology, 125(6), 929-937. Impact Factor: 8.470 [LINK]

  • Lall, P., & Wei, J. (2015). Prediction of L70 life and assessment of color shift for solid-state lighting using Kalman filter and extended Kalman filter-based models. IEEE Transactions on Device and Materials Reliability, 15(1), 54-68. [LINK]

  • Lall, P., Wei, J., & Sakalaukus, P. Life Prediction and Classification of Fault-Modes in Solid State Lamps Using Bayesian Probabilistic Models. IEEE Reliability Digest, 2 (2014):7-18 [LINK]

  • Yang, B., Brazile, B., Jan, N. J., Hua, Y., Wei, J., & Sigal, I. A. (2018). Structured polarized light microscopy for collagen fiber structure and orientation quantification in thick ocular tissues. Journal of biomedical optics, 23(10), 106001.

Ph.D. Dissertation

  • Wei, J. (2017). In-situ Electronics Measurement Using X-ray Micro-Computed Tomography System and Data Driven Prognostic Health Management. [LINK]

Conference Papers

  • Wei, J., Yang, B., Voorhees, A. P., Tran, H., Brazile, B., Wang, B., … & Sigal, I. A. (2018, February). Measuring in-vivo and in-situ ex-vivo the 3D deformation of the lamina cribrosa microstructure under elevated intraocular pressure. In Optical Elastography and Tissue Biomechanics V (Vol. 10496, p. 1049611). International Society for Optics and Photonics.

  • Lall, P., & Wei, J. (2017, May). X-ray micro-CT and DVC based analysis of strains in metallization of flexible electronics. In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on (pp. 1253-1261). IEEE.

  • Lall, P., & Wei, J. (2016, May). Remaining Useful Life Assessment of Field Deployed Electronics Using X-Ray Micro-CT Based Digital Volume Correlation and Finite-Element Analysis. In Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th (pp. 1583-1592). IEEE.

  • Lall, P., & Wei, J. (2016, May). PBGA package Finite Element Analysis based on the physical geometry modeling using X-ray micro-CT digital volume reconstruction. In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on (pp. 285-294). IEEE.

  • Lall, P., & Wei, J. (2015, July). LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V002T01A011-V002T01A011). American Society of Mechanical Engineers.

  • Lall, P., & Wei, J. (2015, May). X-ray micro-CT and digital-volume correlation based three-dimensional measurements of deformation and strain in operational electronics. In Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th (pp. 406-416). IEEE.

  • Lall, P., Wei, J., & Sakalaukus, P. (2015, April). Bayesian models for life prediction and fault-mode classification in solid state lamps. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on (pp. 1-13). IEEE.

  • Lall, P., Wei, J., & Sakalaukus, P. (2014, November). Fault-Mode Classification of Solid State Luminaires Using Bayesian Probabilistic Models. In ASME 2014 International Mechanical Engineering Congress and Exposition (pp. V010T13A079-V010T13A079). American Society of Mechanical Engineers.

  • Lall, P., Wei, J., & Sakalaukus, P. (2014, June). Bayesian probabilistic model for life prediction and fault mode classification of solid state luminaires. In Prognostics and Health Management (PHM), 2014 IEEE Conference on (pp. 1-10). IEEE.

  • Lall, P., Wei, J., & Sakalaukus, P. (2014, May). Life prediction and classification of failure modes in solid state luminaires using Bayesian Probabilistic Models. In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (pp. 2053-2062). IEEE.

  • Lall, P., Wei, J., & Davis, L. (2013, September). Prediction of L70 lumen maintenance and chromaticity for LEDs using extended Kalman filter models. In LED-based Illumination Systems (Vol. 8835, p. 88350M). International Society for Optics and Photonics.

  • Lall, P., Wei, J., & Davis, L. (2013, July). Solid state lighting life prediction using extended kalman filter. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (pp. V001T05A016-V001T05A016). American Society of Mechanical Engineers.

  • Lall, P., Wei, J., & Davis, L. (2013, June). Prediction of lumen output and chromaticity shift in LEDs using Kalman Filter and Extended Kalman Filter based models. In Prognostics and Health Management (PHM), 2013 IEEE Conference on (pp. 1-14). IEEE.

  • Lall, P., Wei, J., & Davis, L. (2013, May). L70 life prediction for solid state lighting using Kalman Filter and Extended Kalman Filter based models. In Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd (pp. 1452-1465). IEEE.

  • Lall, P., Wei, J., & Goebel, K. (2012, May). Comparison of Lalman-filter and extended Kalman-filter for prognostics health management of electronics. In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on (pp. 1281-1291). IEEE.

  • Lall, P., Dornala, K., Wei, J., Lowe, R., & Foley, J. (2015, June). Prognostication of solder-joint reliability of 0.4 mm and 0.5 mm pitch bgas subjected to mechanical shocks up to 10,000 G. In Prognostics and Health Management (PHM), 2015 IEEE Conference on (pp. 1-14). IEEE.

  • Lall, P., Deshpande, S., Wei, J., & Suhling, J. (2014, May). Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT. In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (pp. 1449-1456). IEEE.

  • Lall, P., Sakalaukus, P., Wei, J., & Davis, L. (2014, May). SSL and LED life prediction and assessment of CCT shift. In Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on (pp. 1179-1185). IEEE.